Compact ejectable component assemblies in electronic devices

ABSTRACT

Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.

This application claims the benefit of prior filed U.S. ProvisionalPatent Application No. 61/325,622, filed Apr. 19, 2010, which isincorporated by reference herein in its entirety.

FIELD OF THE INVENTION

This can relate to systems and methods for providing compact ejectablecomponent assemblies in electronic devices.

BACKGROUND OF THE DISCLOSURE

To enhance the use of electronic devices (e.g., cellular telephones),ejectable component assemblies may be used to couple removable modules(e.g., subscriber identity module (“SIM”) cards) to the device. Someknown ejectable component assemblies for personal electronic devicesinclude a tray for receiving a removable module, and a connector coupledto a circuit board within the housing of the device for receiving thetray as it is inserted through an opening in the housing. The connectormay retain the tray such that contacts of the module may be electricallycoupled to the circuit board. However, variations in the manufacture ofsuch electronic devices and the reduction in size of such modulesgenerally create shorts between contacts of the module and othercomponents of the assembly.

SUMMARY OF THE DISCLOSURE

Systems and methods for providing compact ejectable component assembliesin electronic devices are provided.

For example, in some embodiments, there is provided a tray for insertinga removable module into an electronic device. The tray includes a backcomponent configured to retain at least a portion of the module and afront component fixed to the back component and configured to mate withan opening in a housing of the electronic device. A portion of the backcomponent may be configured to touch an electrical contact of themodule, and may be covered with a non-conductive coating or element.

In other embodiments, there is provided a method for forming a tray foran ejectable module assembly of an electronic device. The methodincludes forming a back component for retaining at least a portion of anejectable module, forming a front component for mating with an openingin a housing of the electronic device, and fixing the back component tothe front component. The method may also include applying anon-conductive element to at least one portion of the back component.

In yet other embodiments, there is provided an electronic device thatincludes a housing having an opening, a circuit board within thehousing, a cage, a fixing element coupling the cage to the circuitboard, and a tray operable to be inserted through the opening and into aspace between the cage and the circuit board. The fixing element mayonly allow the tray to be inserted into the space when the tray is in afirst orientation with respect to the circuit board. The electronicdevice may also include a guide positioned at least partially within thecage, wherein the fixing element is positioned between the guide and theopening.

In still yet other embodiments, there is provided an electronic devicethat includes a housing having an opening, a guide within the housing, atray operable to be inserted through the opening and along the guide,and a biasing mechanism. The biasing mechanism may include a first endfixed to a first portion of the guide, a second end abutting a secondportion of the guide, and a middle portion biased against a portion ofthe tray. The portion of the tray may include a detent, and the middleportion of the biasing mechanism or the portion of the tray may includean overmold.

In still yet other embodiments, there is provided an electronic devicethat includes a housing having an opening, a circuit board within thehousing, a base coupled to the circuit board, an electrical pinextending away from the base, and a module operable to be insertedthrough the opening and to contact the electrical pin. The electricalpin may be operable to deflect through a gap in the base in response tothe module contacting the pin. The circuit board may include a recess,and the electrical pin may be operable to deflect into the recess inresponse to the module contacting the pin.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of the invention, its nature, and variousfeatures will become more apparent upon consideration of the followingdetailed description, taken in conjunction with the accompanyingdrawings, in which like reference characters may refer to like partsthroughout, and in which:

FIG. 1 is a perspective view of an illustrative electronic device thatincludes an ejectable component assembly in accordance with someembodiments of the invention;

FIG. 2 is a perspective view of an illustrative tray of the ejectablecomponent assembly of FIG. 1 in accordance with some embodiments of theinvention;

FIG. 3A is a bottom view of a removable module of the ejectablecomponent assembly of FIG. 1, taken from line IIIA-IIIA of FIG. 1, inaccordance with some embodiments of the invention;

FIG. 3B is a side view of the removable module of FIGS. 1 and 3A, takenfrom line IIIB-IIIB of FIG. 3A, in accordance with some embodiments ofthe invention;

FIG. 3C is a bottom view of an adapter including the removable module ofFIGS. 1, 3A, and 3B, in accordance with some embodiments of theinvention;

FIG. 3D is a side view of the adapter of FIG. 3C, taken from lineIIID-IIID of FIG. 3C, in accordance with some embodiments of theinvention;

FIG. 4 is a perspective view of the ejectable component assembly and aportion of the device of FIG. 1, without a tray inserted therein, inaccordance with some embodiments of the invention;

FIG. 5 is a perspective view of the ejectable component assembly anddevice of FIGS. 1 and 4, similar to FIG. 4, but with a tray insertedtherein, in accordance with some embodiments of the invention;

FIG. 6 is a top view of the ejectable component assembly and device ofFIGS. 1, 4, and 5, taken from line VI-VI of FIG. 5, in accordance withsome embodiments of the invention;

FIG. 7 is a cross-sectional view of the ejectable component assembly anddevice of FIGS. 1 and 4-6, taken from line VII-VII of FIG. 6, inaccordance with some embodiments of the invention;

FIG. 8 is a cross-sectional view of the ejectable component assembly anddevice of FIGS. 1 and 4-7, taken from line VIII-VIII of FIG. 6, inaccordance with some embodiments of the invention;

FIG. 9 is a cross-sectional view of the ejectable component assembly anddevice of FIGS. 1 and 4-8, taken from line IX-IX of FIG. 6, inaccordance with some embodiments of the invention;

FIG. 10 is a cross-sectional view of the ejectable component assemblyand device of FIGS. 1 and 4-9, taken from line X-X of FIG. 6, inaccordance with some embodiments of the invention;

FIG. 11 is a cross-sectional view of the ejectable component assemblyand device of FIGS. 1 and 4-10, taken from line XI-XI of FIG. 6, inaccordance with some embodiments of the invention;

FIG. 12 is a cross-sectional view of the ejectable component assemblyand device of FIGS. 1 and 4-11, taken from line XII-XII of FIG. 6, inaccordance with some embodiments of the invention;

FIG. 13 is a cross-sectional view of the ejectable component assemblyand device of FIGS. 1 and 4-12, taken from line XIII-XIII of FIG. 6, inaccordance with some embodiments of the invention;

FIG. 14 is a flowchart of an illustrative process for manufacturing atray of an ejectable component assembly in accordance with someembodiments of the invention; and

FIG. 15 is a flowchart of an illustrative process for manufacturing atray of an ejectable component assembly in accordance with some otherembodiments of the invention.

DETAILED DESCRIPTION OF THE DISCLOSURE

Systems and methods for providing compact ejectable component assembliesin electronic devices are provided and described with reference to FIGS.1-15.

An ejectable component assembly may include any suitable assemblyoperative to insert into an electronic device and eject from anelectronic device a removable module, such as a subscriber identitymodule (“SIM”) card. The assembly can include a module tray that mayhold the module and be insertable into and ejectable from the device.The tray may include a cosmetic outer portion configured to match theexterior of the electronic device through which the tray may beinserted, and a holder inner portion configured to retain the module andload it into the electronic device. In order to closely define the sizeand shape of the junction between such a cosmetic outer portion andholder inner portion, such that the tray may form a tight fit with anopening through an external housing of the electronic device, these twoportions may be provided as two distinct tray portions that may bewelded or otherwise adhered together to form the tray. By forming thetray using two distinct elements, the outer cosmetic portion may beformed with materials and processes similar to the exterior of theelectronic device to make the device more cosmetically appealing to theuser when the tray is loaded into the device, whereas the holder innerportion may be formed with different materials and processes that may beoptimal for providing a rigid and functional module holding portion ofthe tray.

In some embodiments, at least the holder inner portion of the tray maybe formed by a metal or other conductive material with enough rigidityto hold a module. Therefore, in order to avoid shorting electricalcontacts of the module (e.g., a SIM card), one or more non-conductiveportions may be provided along the holder inner portion of the tray. Insuch embodiments, at least some of the conductive portions or all of thetray can be anodized and/or coated with a non-conductive material and/orotherwise provided with non-conductive elements, such that it may beinsulated and rendered non-conductive to avoid shorting any electricalcontacts of the module that it might touch during use.

While the opening in the device may be sized and shaped to allow thetray to be inserted therethrough in any orientation, portions of theejectable component assembly within the device may only be configured toreceive the tray in one or more certain orientations. Therefore, one ormore various keying elements of the ejectable component assembly may beprovided within the electronic device adjacent the opening through whichthe tray may be inserted. Each keying element may be provided to limitthe manner in which the tray may be inserted through the opening. Forexample, each keying element may only allow the tray to be inserted intothe device when the tray is in a first orientation with respect to theopening or other components of the electronic device. A keying elementmay also be used to join distinct elements of the assembly to oneanother, such as a receiving cage and a circuit board of the device.

Electrical contacts of the removable module may be inserted into thedevice in order to functionally align with and electrically couple toelectrical contacts extending from a circuit board of the device. Insome embodiments, one or more recesses may be provided through thecircuit board or other components of the device such that when theremovable module physically interacts with the contacts, at least aportion of the contacts may be forced downwardly through the recesses.These recesses may prevent the contacts from being damaged duringinteraction with the module and/or during removal of the module from thedevice.

The following discussion describes various embodiments of an electronicdevice that includes at least one ejectable component assembly. The term“electronic device” can include, but is not limited to, music players,video players, still image players, game players, other media players,music recorders, video recorders, cameras, other media recorders,radios, medical equipment, calculators, cellular telephones, otherwireless communication devices, personal digital assistants, remotecontrols, pagers, laptop computers, desktop computers, tablets, servers,printers, or combinations thereof. In some cases, the electronic devicemay perform a single function (e.g., an electronic device dedicated toplaying music) and in other cases, the electronic device may performseveral functions (e.g., an electronic device that plays music, displaysvideo, stores pictures, and receives and transmits telephone calls).

The electronic devices may generally be any portable, mobile, hand-held,or miniature electronic device so as to allow a user, for example, tolisten to music, play games, record videos, take pictures, and/orconduct communications operations (e.g., telephone calls) wherever he orshe travels. Some miniature electronic devices may have a form factorthat is smaller than that of hand-held electronic devices, such as aniPod™ available by Apple Inc. of Cupertino, Calif. Illustrativeminiature electronic devices can be integrated into various objects thatinclude, but are not limited to, watches, rings, necklaces, belts,accessories for belts, headsets, accessories for shoes, virtual realitydevices, other wearable electronics, accessories for sporting equipment,accessories for fitness equipment, key chains, or any combinationthereof. Alternatively, electronic devices that incorporate an ejectablecomponent assembly may not be portable at all.

FIG. 1 is a perspective view of an illustrative electronic device 10that may include an ejectable component assembly in accordance with someembodiments of the invention. Electronic device 10 can include at leastone user input component assembly 12 that may allow a user to interfacewith the device, at least one device output component assembly 14 thatmay provide the user with device generated information, at least oneejectable component assembly 16 that may allow a user to insert andeject a removable module into and from the device, and a protectivehousing 18 that may at least partially enclose the one or more input,output, and ejectable component assemblies of device 10.

Component assemblies 12 and 14 can include any type of componentassembly operative to receive and/or transmit digital and/or analog data(e.g., audio data, video data, other types of data, or a combinationthereof). Input component assembly 12 may include any suitable inputmechanism, such as, for example, sliding switches, buttons, keypads,track balls, joysticks, dials, scroll wheels, touch screen displays,electronics for accepting audio and/or visual information, antennas,infrared ports, or combinations thereof. Output component assembly 14may include any suitable output component forms, such as, for example,audio speakers, headphones, audio line-outs, visual displays, antennas,infrared ports, rumblers, vibrators, or combinations thereof. It shouldbe noted that one or more input component assemblies 12 and one or moreoutput component assemblies 14 may sometimes be referred to collectivelyherein as an input/output (“I/O”) interface. It should also be notedthat an input component assembly 12 and an output component assembly 14may sometimes be a single I/O component, such as a touch screen that mayreceive input information through a user's touch of a display screen andthat may also provide visual information to a user via that same displayscreen.

Ejectable component assembly 16 may include any suitable assemblyoperative to insert and eject a removable module 30 from device 10.Removable module 30 may include, for example, any suitable type ofintegrated circuit card (“ICC”), chip card, memory card, flash memorycard, microprocessor card, smart card, such as a subscriber identitymodule (“SIM”) card (e.g., a mini-SIM card or a micro-SIM card), orcombinations thereof. In some embodiments, removable module 30 maycontain electronic circuitry from which electronic device 10 may readdata and/or to which device 10 may write data.

Ejectable component assembly 16 can include a module tray 20 that may beinsertable into (e.g., in the direction of arrow I) and ejectable from(e.g., in the direction of arrow O) housing 18 through housing opening19. It is to be noted that although opening 19 is shown in FIG. 1 to beprovided through a wall that may be defining a width of housing 18,opening 19 for ejectable component assembly 16 may be provided throughany wall portion of housing 18. For example, in some embodiments,opening 19 for ejectable component assembly 16 may be provided through awall that may be defining a length of housing 18, which may be longerthan the wall defining the width of housing 18 (e.g., the wall ofhousing 18 along which input component assembly 12 is provided as shownin FIG. 1).

In some embodiments, housing 18 may include an outer periphery memberthat can provide a variety of attributes to electronic device 10including for example, structural, functional, cosmetic, or combinationsthereof. The outer periphery member may for example form at least aportion of the right, left, top, and bottom sides of device 10. As such,the outer periphery member may surround components that are placed indevice 10 back to front, front to back, or center to back and front(e.g., components inserted within the volume defined by the outerperiphery member). The outer periphery member may be formed from one ormore elements, which may be similar or different depending on thedimensions or shape of device 10, as well as functional or structuralconsiderations (e.g., outer periphery member elements serving as anantenna for tuning electromagnetic waves). If several elements arecombined to form the outer periphery members, the elements can beconnected in any suitable manner to form a single unit having adequatestructural, functional, or cosmetic properties. In some cases, the outerperiphery member can be formed from several elements that may act as asingle integral unit (e.g., a unitary part). For example, the elementscan be combined together as a single component using an assembly process(e.g., molding, welding, or an adhesive).

In some embodiments, such an outer periphery member of device 10 candefine a band that forms an enclosed volume having a front and back openarea. The band may define a ring-like structure that wraps around someor all of the components of electronic device 10. Electronic device 10can include a variety of components, such as housing elements,electronics, structural members, or combinations of these. In somecases, one or more structural members (e.g., a mid-plate) can beconnected to the outer periphery member within the volume enclosed bythe outer periphery member to receive and support components, or enhancethe structural properties of the outer periphery member.

In some embodiments, electronic device 10 can include front and backcover assemblies operative to cap the volume defined by such an outerperiphery member. The cover assemblies can be positioned relative to theopen areas of the outer periphery member and can include any suitablefeature, including for example housing portions, access points,electronics, structural members, aesthetic members, or combinationsthereof. In some embodiments, the cover assemblies can include one ormore features for securing or retaining electronic device componentswithin the volume enclosed by the outer periphery member. The coverassemblies can include surfaces defining the front and back surfaces ofdevice 10. Each cover assembly can include a single enclosure member orcan include several components such as, for example, a glass plate, adisplay, an input interface, or combinations of these.

Such an outer periphery member and front and back cover assemblies canprovide some or all of the exterior surfaces of device 10, and thusdefine the outer periphery form or look and feel of electronic device10. In particular, the front cover can substantially form the frontsurface of device 10, the back cover can substantially form the backsurface of device 10, and the outer periphery member can substantiallyform the top, bottom, left, and right surfaces of device 10. It is to beunderstood, however, that some or all of the cover assemblies caninstead or in addition provide part of the top, bottom, left, or rightsurfaces of device 10, and that some or all of the outer peripherymember can provide part of the front or back surfaces of device 10.Therefore, in some embodiments, opening 19 for ejectable componentassembly 16 may be provided through any such outer periphery member orband or cover assembly of device 10.

Tray 20 of ejectable component assembly 16 may include a body portion 22extending between a first tray end 21 and a second tray end 23. Tray 20may include an outer surface 21 x at first end 21 to provide a cosmeticsurface for device 10 when tray 20 is inserted into device 10. In someembodiments, outer surface 21 x of tray 20 may be fashioned to beaesthetically pleasing to a user of device 10, for example, by matchingthe color and/or material of surface 21 x with that of the exteriorsurface of housing 18 about opening 19 (e.g., any such outer peripherymember or band or cover assembly of device 10 through which opening 19may be provided). First tray end 21, second tray end 23, and/or bodyportion 22 may define the periphery and/or walls of a module holder 24.Module holder 24 may be operative to receive and hold removable module30 with respect to tray 20 (e.g., when module 30 is inserted into holder24 in the direction of arrow H). More particularly, module holder 24 maybe operative to receive and hold removable module 30 with respect to anopening 26 that may be provided through a portion of tray 20.

Tray 20 may be formed as a single unitary component from any suitablematerial, such as plastic, glass, metal, ceramic materials, epoxies,composite materials, or the like. Moreover, tray 20 may be a singleunitary component made by any suitable process, such as casting,molding, forming, forging, machining, extruding, and the like.Alternatively, tray 20 may be formed by joining at least two distincttray portions. For example, as shown in FIG. 2, tray 20 may include afirst tray component 25 and a second tray component 27. Second traycomponent 27 may be a cosmetic outer portion including outer surface 21x and an inner surface 21 n. Second tray component 27 may be sized andshaped to fit within housing opening 19. First tray component 25 may bea module holding portion extending between an inner surface 23 n and anouter surface 23 x. Module holder 24 may be formed through a portion oftop surface 28 t of first tray component 25 to a middle surface 28 m,and opening 26 may be formed through a portion of middle surface 28 m tobottom surface 28 b of first tray component 25. Holder 24 can be sizedto substantially match that of a module (e.g., module 30 of FIG. 1),such that the module can be snap-fitted or otherwise releasably retainedin holder 24, and such that a portion of the module may be exposedthrough opening 26. For example, opening 26 may allow electricalcircuitry of electronic device 10 to access data from one or moreelectrical contacts of the module through opening 26 when tray 20 ispartially or fully inserted into device 10.

One or more protrusions 29 p may be formed along one or more portions offirst tray component 25, such as along one or both of external sidewalls 28 s. As described with respect to FIGS. 4-13, protrusions 29 pmay be of any suitable shape and size and may interact withcorrespondingly shaped elements of assembly 16 within device 10 in orderto guide tray 20 into its appropriate position within device 10. Asshown, the top of protrusions 29 p may be in the same plane as topsurface 28 t of first tray component 25. In some embodiments, first traycomponent 25 may also include one or more detents 29 d that may beplaced on the top, bottom, or various sides of tray 20. For example, asshown in FIG. 2, each protrusion 29 p may include at least one detent 29d formed into each side wall 28 s of tray component 25 (e.g., adjacentend 23). As described with respect to FIGS. 4-13, detents 29 d mayinteract with biased mechanisms of assembly 16 within device 10 in orderto retain tray 20 in a functional position with device 10. The depth ofeach detent 29 d may be selected based on any suitable criteria,including, for example, such that detent 29 d may receive a portion of aspring mechanism for securing tray 20 in a functional position.

By creating tray 20 with at least two distinct tray components, eachcomponent may be made from different materials and by differentprocesses than the other component, such that each component may beformed to have the most optimal properties for its specificfunctionalities. Second tray component 27 may be formed to beaesthetically pleasing to a user of device 10, for example, by matchingthe color and/or material of surface 21 x with that of housing 18 aboutopening 19. Therefore, the materials, processes, and finishes used toform second tray component 27 may be chosen in accordance with thoseused to form the exterior surface of housing 18 about opening 19 (e.g.,any such outer periphery member or band or cover assembly of device 10through which opening 19 may be provided). While, on the other hand, thematerials, processes, and finishes that may be used to form first traycomponent 25 may be chosen without respect to housing 18 and/or traycomponent 27, and tray component 25 may be formed such that thestructure of module holder 24 and opening 26 are accurately dimensionedto receive a module.

First tray component 25 and second tray component 27 may then be coupledto one another using any suitable process, such as brazing or welding.For example, inner surface 23 n of first tray component 25 and innersurface 21 n of second tray component 27 may be coupled to one another.By independently controlling the formation of tray components 25 and 27,as well as their connection to one another, the shapes created by theunion of their various surfaces may be tightly controlled. For example,as shown in FIG. 6, a right angle may be formed at the union of sidesurface 28 s of first component 25 and inner surface 21 n of secondcomponent 27, and, as shown in FIG. 13, a right angle may be formed atthe union of top surface 28 t of first component 25 and inner surface 21n of second component 27. By matching the shape of such unions ofsurfaces of tray 20 with the shape of portions of housing 18 aboutopening 19, a tighter fit may be formed between tray 20 and housing 18(e.g., smaller spacings S1 and/or S2 of FIGS. 6 and 13 may be achievedbetween housing 18 and tray 20). Such a tight clearance fit may producea more aesthetically pleasing result and a more accurate system than maybe possible if tray 20 were to be formed as a single unitary componentand its surfaces' unions were to be merely machined, for example.

In some embodiments, the size of tray 20 may be of a small enough sizewhere plastic or other similar materials may not provide the necessaryrigidity, and metal or another conductive material may be used to format least a portion of tray 20. In such embodiments, all of tray 20 or atleast some of a conductive portion of tray 20 can be anodized, coated,and/or otherwise covered with a non-conductive material or element suchthat it may be insulated and rendered substantially not conductive. Forexample, if the removable module includes one or more electricalcontacts that may touch tray 20 when the module is retained in moduleholder 24, at least that portion of tray 20 may be coated with anon-conductive material or otherwise covered with a non-conductiveelement so as not to short the electrical contacts of the module.

As described below with respect to FIGS. 4-13, a module may bepositioned within holder 24 of tray 20 such that a surface of the moduleincluding one or more electrical contacts may be resting on middlesurface 28 m of tray 20. Therefore, in order to ensure that tray 20 doesnot short any electrical contacts of the module, a non-conductiveelement or coating may be applied to one or more portions of middlesurface 28 m and/or to one or more portions of internal surface 28 i oftray 20 extending between surface 28 m and top surface 28 t (see, e.g.,non-conductive portions 95 of FIGS. 2, 8, and 10). Such non-conductiveportions 95 may be especially useful when a conductive tray 20 is usedto hold a micro-SIM card or any other module that may include contactsthat extend very close to if not all the way to one or more edges of thecard (see, e.g., contacts 34 of FIG. 10, which may not only contact anon-conductive portion 95 applied to middle surface 28 m of tray 20, butwhich may also extend to an edge of module 30 and contact anon-conductive portion 95 applied to an internal surface 28 i of tray20).

One or more non-conductive portions 95 may be applied to conductive tray20 using any suitable approach, such as by physical vapor deposition(“PVD”) using Parylene or any other suitable material, by spraying anon-conductive paint, by dip coating, by pad printing, by applyingnon-conductive labels, by adhering non-conductive elements, and thelike. In some embodiments, one or more non-conductive portions 95 may beapplied to tray 20 after tray components 25 and 27 have been coupledtogether, such that any fixtures used to join the tray components maynot be able to rub off or otherwise degrade the non-conductive elementsor coatings.

As mentioned, tray 20 may be configured to receive and retain anysuitable module for insertion into device 10, such as an integratedcircuit card, chip card, memory card, flash memory card, microprocessorcard, smart card, such as a SIM card, and the like. As shown in FIGS. 1,3A, and 3B, for example, module 30 may include a top surface 31 and abottom surface 33. One or more electrical contacts 34 may be exposedalong bottom surface 33. Therefore, when bottom surface 33 of module 30is placed against middle surface 28 m of holder 24 of tray 20, at leasta portion of some or all of contacts 34 may be exposed through opening26 of tray 20 (see, e.g., FIGS. 8, 10, and 13). In some embodiments, oneor more module retainers or module retaining elements 126 may be coupledto one or more portions of holder 24 for retaining module 30 therein.For example, retaining element 126 may be a spring flexure coupled totray 20 such that the spring flexure may be compressed by removablemodule 30 upon its insertion into holder 24 for tightly retaining module30 therein. Alternatively or additionally, module retaining element 126may be any other suitable mechanism, including, but not limited to, asupporting rib of a compliant material, a flange, or the like. In otherembodiments, module 30 may snap-fit into holder 24.

As mentioned, in some embodiments, tray 20 may be configured to hold amodule 30 that is a micro-SIM card, whose dimensions and/or contactconfigurations may be determined by a particular specification (e.g.,the ISO 7816 specification). For example, module 30 as a micro-SIM cardmay have a particular length L, width W, and thickness T, such as about15 millimeters, by 12 millimeters, by 0.76 millimeters, and thedimensions of holder 24 of tray 20 may be dimensioned similarly.However, in alternative embodiments, tray 20 may be configured to hold amodule that is a mini-SIM card, whose dimensions and/or contactconfigurations may be determined by a different specification than themicro-SIM specification. For example, a mini-SIM specification mayrequire a module to have the same contact configurations as a micro-SIM,but different dimensions than a micro-SIM, such as a length of 25millimeters, a width of 15 millimeters, and a thickness of 0.76millimeters. Therefore, while the electrical contacts of the two modulesmay be interchangeable, their different dimensions may prevent the twomodules from being handled by the same tray 20.

However, in some embodiments, as shown in FIGS. 3C and 3D, a moduleadapter 30′ may be provided that can allow for a module of a first typeto be handled by a tray configured to hold a module of a second type.For example, continuing with the example of module 30 being a micro-SIMcard and tray 20 being configured to hold a mini-SIM card, adapter 30′may be configured to have the same dimensions as a mini-SIM card, butwith an opening configured to hold a micro-SIM card. As shown in FIGS.3C and 3D, adapter 30′ may have a length L′, a width W′, and a thicknessT′, which may be configured to correspond to the length of 25millimeters, the width of 15 millimeters, and the thickness of 0.76millimeters required by a mini-SIM. However, adapter 30′ may alsoinclude an opening 36 between its top surface 31′ and its bottom surface33′ that may be configured to retain therein module 30 of FIGS. 3A and3B. Opening 36 may be positioned in adapter 30′ such that contacts 34 ofmodule 30 may be positioned with respect to adapter 30′ as wouldcontacts of a module having the dimensions of adapter 30′ (e.g., amini-SIM card). Therefore, module 30 may be retained by adapter 30′, andadapter 30′ may be retained by tray 20 if tray 20 is configured toretain a mini-SIM card.

In some embodiments, one or more module retainers or module retainingelements 136 may be coupled to one or more portions of adapter 30′ forretaining module 30 therein. For example, retaining element 136 may be aspring flexure coupled to adapter 30′ such that the spring flexure maybe compressed by removable module 30 upon its insertion into opening 36for tightly retaining module 30 therein. Alternatively or additionally,module retaining element 136 may be any other suitable mechanism,including, but not limited to, a supporting rib of a compliant material,a flange, or the like. In other embodiments, a module retaining element136′ may be provided as a flange extending under opening 36 forsupporting module 30. In yet other embodiments, module 30 may snap-fitinto opening 36 of adapter 30′.

Adapter 30′ may be formed of any suitable material, such as plastic,glass, metal, ceramic materials, epoxies, composite materials, and thelike. Like tray 20, adapter 30′ may be at least partially formed frommetal or another conductive material. In such embodiments, at least someof the conductive portion or all of adapter 30′ can be anodized and/orcoated with a non-conductive material such that it may be insulated andrendered substantially not conductive. For example, if the removablemodule includes one or more electrical contacts that may touch adapter30′ when the module is retained in adapter 30′, at least that portion ofadapter 30′ may be covered with a non-conductive material so as not toshort the electrical contacts of the module (see, e.g., non-conductiveportions 95 of tray 20).

FIGS. 4 and 5 are perspective views of a portion of device 10 includingejectable component assembly 16 before and after tray 20 is inserted inelectronic device 10, respectively, in accordance with some embodimentsof the invention. FIG. 6 is a top view of assembly 16 of FIG. 5, whileFIGS. 7-13 are various cross-sectional views of assembly 16 of FIGS. 5and 6. As shown, ejectable component assembly 16 may include a cage 40positioned on top of a circuit board 50 and operative to receive and/orrestrain tray 20 at least partially within the space defined betweencage 40 and board 50. For example, as shown in FIGS. 4 and 5, cage 40can include a top portion 42 that may be positioned above and that maybe substantially parallel to circuit board 50. In some embodiments, cage40 may include one or more sidewalls 44 extending from top portion 42that may hold top portion 42 above circuit board 50 (e.g., cage 40 mayresemble an upside-down U-shape coupled to circuit board 50). Module 30may be placed in tray 20 and tray 20 may be slid through housing opening19 in the direction of arrow I into the space defined by top cageportion 42, sidewall cage portions 44, and circuit board 50.

Cage 40 may have any suitable length C extending between a front cageend 41 and a back cage end 43, which may or may not extend over theentirety of tray 20 when tray 20 is fully inserted into device 10. Cage40 may be formed of any suitable material, such as plastic, glass,metal, ceramic materials, epoxies, composite materials, and the like.Cage 40 may be coupled to any suitable component of assembly 16 and/ordevice 10, such as circuit board 50, using any suitable approach,including, for example, soldering, surface mount technology, welding,adhesives, and the like. For example, as shown in FIGS. 4-6 and 10, cage40 may be coupled to circuit board 50 or any other suitable component ofdevice 10 by one or more side cage coupling elements 45 (e.g., solder,adhesives, mechanical tabs, etc.), which may extend from one or moresidewalls 44 of cage 40.

Additionally or alternatively, cage 40 may be coupled to circuit board50 or any other suitable component of device 10 by one or more frontcage coupling elements 47 (e.g., solder, adhesives, mechanical tabs,etc.). For example, as shown in FIGS. 4, 5, and 11, cage 40 may includeone or more front cage coupling elements 47 that may extend from topwall 42 and/or one or more sidewalls 44 at or near front cage end 41.Each front cage coupling element 47 may span at least a portion of frontopening 91 defined by board 50, top wall 42, and sidewalls 44 at or nearfront cage end 41 through which tray 20 passes. In some embodiments,cage 40 may include one or more middle walls 49 a, which may bepositioned between side walls 44 at front end 41 of cage 40, and whichmay extend from top wall 42 at least partially to circuit board 50 orany other suitable portion of device 10. Middle wall 49 a may spanacross at least a portion of front opening 91. Cage 40 may be coupled tocircuit board 50 or any other suitable portion of device 10 by one ormore front cage coupling elements 47 a (e.g., solder, adhesives,mechanical tabs, etc.), which may extend from middle wall 49 a and/ordirectly from top wall 42 to circuit board 50 or any other suitableportion of device 10. Additionally or alternatively, cage 40 may includea corner wall 49 b, which may be positioned to extend from one of sidewalls 44 at or near front end 41 of cage 40, and which may extend fromtop wall 42 at least partially to circuit board 50 or any other suitableportion of device 10. Corner wall 49 b may span across at least aportion of front opening 91. Cage 40 may be coupled to circuit board 50or any other suitable portion of device 10 by one or more front cagecoupling elements 47 b (e.g., solder, adhesives, mechanical tabs, etc.),which may extend from corner wall 49 b to circuit board 50 or any othersuitable portion of device 10. By coupling cage 40 to circuit board 50or any other suitable portion of device 10 at or near front end 41 ofcage 40, the potential for cage 40 to move in the direction of arrow Iand/or O may be reduced.

As shown in FIG. 11, for example, each one of front cage couplingelement 47 a, front cage coupling element 47 b, middle wall 49 a, andcorner wall 49 b may be positioned within front opening 91. In someembodiments, one or more of front cage coupling element 47 a, front cagecoupling element 47 b, middle wall 49 a, and corner wall 49 b may bepositioned within opening 91 so as to be a keying element for guidingtray 20 through opening 91 only if tray 20 is in a proper orientationwith respect to device 10. For example, tray 20 may only pass throughopening 91 if protrusion 29 p is properly positioned or oriented withrespect to the keying element. This may ensure that tray 20 is properlybeing inserted with bottom surface 28 b facing downwardly towardscircuit board 50. In other embodiments, as shown at least in FIGS. 4 and12, a keying element may alternatively or additionally be provided by akeying plate 99, which may be coupled to an interior surface of housing18 about opening 19. Keying plate 99 may be coupled to housing 18 in anysuitable manner, such as by welding or otherwise adhering plate 99 tohousing 18 or by machining plate 99 from housing 18. Keying plate 99 maybe colored or otherwise treated to match housing 18 or to be discretesuch that it is not visible through opening 19 by a user of device 10.

Circuit board 50 may be any type of circuit board, such as a printedcircuit board (“PCB”), logic board, printed wiring board, etched wiringboard, or any other suitable board that may be used to mechanicallysupport and electronically connect various electrical components (e.g.,component assemblies 12, 14, and 16). Circuit board 50 can beconstructed using one or more layers of a non-conductive substrate andsignal conducting pathways. The signal conducting pathways may exist inone or more layers or in each layer of the non-conductive substrate. Thesignal conducting layers, sometimes referred to as traces, members, orleads, may be a metal conductive material (e.g., copper or gold) or anoptical conductive material (e.g., fiber optics). When one or moreportions of component assemblies 12, 14, and 16 are electrically coupledto board 50 via coupling circuitries, board 50 may communicate with theone or more component assemblies of device 10 using the signalconducting layers.

To further guide and retain tray 20 within device 10, assembly 16 mayinclude a guide component 60. Guide 60 may be coupled to any suitableelement within assembly 16 and/or device 10, such as circuit board 50.Guide 60 may be of any suitable shape and may be placed in any suitablelocation within device 10 to guide and/or retain at least a portion oftray 20 and/or module 30. In some embodiments, guide 60 may extend alongcircuit board 50 at least partially within cage 40. Guide 60 may beformed of any suitable material, such as plastic, glass, metal,ceramics, epoxies, composite materials, or the like.

In order to guide tray 20 within device 10, guide 60 may include railportions 62 that can have a shape that substantially complementsportions of tray 20 (e.g., protrusions 29 p). For example, when tray 20is inserted into device 10 in the direction of arrow I, protrusions 29 pmay mate with and slide along rail portions 62 of guide 60. Protrusions29 p and guide rails 62 may be any suitable complementary shapes thatmay promote the sliding of tray 20 along rails 62. Guide 60 may alsoinclude a wedge ramp 63 operative to assist in retaining module 30 intray 20. Ramp 63 may be of any suitable shape and may be placed in anysuitable position within guide 60. In some embodiments, ramp 63 may bepositioned such that the tip of tray 20 (e.g., tray end 23) ismaintained away from circuit board 50. This may allow ramp 63 to biastray 20 up to secure module 30 between module holder 24 and the bottomof cage 40, and to prevent tray 20 from slipping underneath module 30during removal (e.g., when the walls 28 i of module holder 24 are lessthan the thickness T of module 30).

Assembly 16 may also include a base module 64, which may be mechanicallysupported and electronically coupled to various other components indevice 10, such as circuit board 50. Base module 64 can be, for example,any integrated circuit (“IC”), such as a microchip, silicon chip, orcomputer chip. In some embodiments, base 64 may provide an interface formodule 30 to electrically communicate with other components in device 10(e.g., board 50). In some embodiments, base 64 and guide 60 may beintegrated into a single unitary component (e.g., a single plasticblock). In some embodiments, cage 40 may be at least partially coupledto guide 60 and/or base 64 as opposed to or in addition to circuit board50.

Cage 40, guide 60, and base 64 may collectively define a shelf orreceiving assembly for receiving, guiding, and holding tray 20 and/ormodule 30 within device 10. In some embodiments, cage 40, guide 60, andbase 64 may be integrated into a single unitary component (e.g., asingle block of plastic or any other suitable material or combination ofmaterials). While cage 40 of the receiving assembly may help to limitthe movement of tray 20 in the “Z” direction above board 50 and/or base64, and while base 64 of the receiving assembly may help to limit themovement of tray 20 in the “Z” direction below cage 40, guide 60 of thereceiving assembly may help to limit the movement of tray 20 in the “X”and/or “Y” directions between cage 40 and board 50 and/or base 64.

Base 64 may include one or more electrical pins 66 that may electricallycouple with one or more conductive portions of module 30 (e.g., modulecontacts 34). For example, as shown in at least FIGS. 4, 8-10, and 13,one or more electrical pins 66 may each be coupled at one end to base 64and may be configured to extend up away from the periphery of base 64and into tray opening 26 for electrically coupling with a respectivecontact 34 of module 30. Module contacts 34 can include any suitableintegrated circuit (“IC”), such as a microchip, silicon chip, orcomputer chip that may include semiconductor and/or passive componentsin the surface of a thin substrate of semiconductor material (e.g., onbottom surface 33 of module 30). The electrical contact between modulecontacts 34 and electrical pins 66 may allow device 10 to read data fromand/or write data into module 30. The data read from and/or written intomodule 30 may take any electrical form, and the communication betweenmodule 30 and device 10 may be synchronous or asynchronous.

Electrical pins 66 may have any suitable shape. For example, eachelectrical pin 66 may be biased to deflect upward away from base 64 andthrough opening 26 in tray 20. Electrical pins 66 may include springs orwedges operative to contact module 30. For example, electrical pins 66may be coupled to any suitable location or portion of base 64 to form acantilever spring. Each electrical pin 66 may be formed from anysuitable conductive material (e.g., a metallic conductor, semiconductor,or superconductor) to communicate with electrical contacts 34 of module30. In some embodiments, as shown in at least FIGS. 9 and 13, a firstend 65 of each electrical pin 66 may be coupled to base 64. Furthermore,in some embodiments, first pin end 65 and base 64 may be electricallycoupled to circuit board 50 (e.g., via a wire 51), such that electricaldata may be communicated between module 30 and board 50 through pin 64.Circuit board 50 may then communicate this data to various othercomponents of device 10 (e.g., component assemblies 12 and/or 14).

Although each pin 66 may at least initially extend away from first end65 and base 64 up towards tray 20, a second free end of each pin mayeventually deflect downwards back towards base 64. For example, as shownin at least FIGS. 7 and 13, a second end 67 of each electrical pin 66may be free and may be biased to deflect downwards towards base 64. Insome embodiments, base 64 may include one or more gaps or at leastrecesses 68 for allowing second end 67 of each pin 66 to passtherethrough or at least deflect therein. Moreover, in some embodiments,circuit board 50 may also include one or more gaps or at least recesses58 for allowing second end 67 of each pin 66 to deflect therein afterhaving passed through a base gap 68. The additional deflection affordedto pins 66 by base gaps 68 and circuit board recesses 68 may preventpins 66 from being permanently deformed as a result of a strong downwardforce exerted by tray 20 and/or module 30 on pins 66 toward board 50.When tray 20 is being removed from device 10, second pin ends 67 maydeflect upwards away from board 50, but, due to the additional downwarddeflection afforded to pins 66 by base gaps 68 and circuit boardrecesses 58, pins 66 may be biased such that second pin ends 67 may notdeflect upwards so much so that they can be snagged by tray 20 upon itsremoval.

In some embodiments, as shown in at least FIGS. 10 and 13, cage 40 mayinclude one or more biasing elements 46 extending downwardly from orthrough top wall portion 42 for contacting and forcing or biasing module30 towards holder 24 of tray 20. The force applied by each biasingelement 46 may also bias module 30 towards electrical pins 66 of base64, thus enhancing their electrical contact. Each biasing element 46 mayinclude any suitable type of spring, protrusion, wedge, or othersuitable component to force or bias module 30 towards base 64. Forexample, biasing element 46 may include a tension spring, extensionspring, compression spring, torsional spring, wire spring, coil spring,flat spring, cantilever spring, helical spring, hairspring, balancespring, leaf spring, or any combination thereof. Each biasing element 46may be coupled to cage 40 using any suitable approach or may instead orin addition be constructed as part of cage 40 (e.g., as a protrusion orcutout). Moreover, cage 40 may include one or more stiffening ribs 48that may extend along or through at least a portion of top wall 42 forproviding additional rigidity to cage 40.

As described above, guide 60 may be operative to engage and retain tray20. For example, guide 60 can include one or more rail features 62 thatmay be constructed to complement tray protrusions 29 p of tray 20. Rails62 and protrusions 29 p may include complementing features to assist inguiding tray 20 into assembly 16 (e.g., towards its functional positionwith module 30 above pins 66 of base 64) and to retain the periphery oftray 20 (e.g., side walls 28 s).

As also mentioned, tray 20 may include at least one detent 29 d. Eachdetent 29 d may be operative to receive a portion of a biasing mechanismfor holding tray 20 within assembly 16 at its functional position. Insome embodiments, as shown in at least FIGS. 4-9, a biasing mechanism 84may be fixed at a first end 85 and may include a middle portion 86biased towards tray 20. For example, each detent 29 d may be operativeto receive a middle portion 86 of a biasing mechanism 84, such that whentray 20 is fully inserted in device 10 at its functional position,middle portion 86 may engage at least one detent 29 d. In someembodiments, first end 85 of a biasing mechanism 84 may be fixed toguide 60 (e.g., at a position on a rail 62) or another portion of device10. A second end 87 of biasing mechanism 84 may abut or otherwisecontact guide 60 or another portion of device 10, so as to applypressure against second end 87 such that it may not be totally free tomove in any direction. Alternatively, a second end 87 of biasingmechanism 84 may be fixed to guide 60 or another portion of device 10,so as to apply pressure against second end 87 such that it may not betotally free to move in any direction. This may make biasing mechanism84 more robust for biasing middle portion 86 against tray 20 and forfurther ensuring that tray 20 remains substantially immobile withindevice 10 at its functional position.

Each end of biasing mechanism 84 may be coupled to, fixed on, abut, orotherwise contact any other suitable component within device 10 besidesguide 60 in other embodiments, such as cage 40, for example. Biasingmechanism 84 may be of any suitable spring type, such as a tensionspring, extension spring, compression spring, torsional spring, wirespring, coil spring, flat spring, cantilever spring, helical spring,hairspring, balance spring, leaf spring, or any combination thereof, asto effectively assist in retaining tray 20. Biasing mechanism 84 may beformed of any suitable material, such as stainless steel and the like.If middle portion 86 of biasing mechanism 84 and at least detent 29 d oftray 20 are both metal, for example, one or both of middle portion 86and detent 29 d may be provided with an over mold 89 (e.g., of plastic)or any other suitable coating or element in order to prevent galling.

It is to be understood that, although ejectable component assembly 16has been described as including a tray 20 for loading a removable module30 into device 10, tray 20 may be unnecessary and any removable moduleor module/adapter combination to be inserted into device 10 may beshaped with some or all of the features of tray 20. For example, aremovable module can be provided that may be substantially the same asremovable module 30, but that also can include a first end shapedsimilarly to end 21 x of tray 20, a second end shaped similarly to end23 x of tray 20, and projections/detents shaped similarly to projections29 p/detents 29 d of tray 20, such that the module may be inserted intoand removed from device 10 in the same way that tray 20 may be insertedinto and removed from device 10.

FIG. 14 is a flowchart of an illustrative process 1400 for manufacturinga tray of an ejectable component assembly. At step 1402 of process 1400,a back component of a tray for retaining at least a portion of anejectable module may be formed. At step 1404, a front component formating with an opening in a housing of an electronic device may beformed. Then, at step 1406, the back component may be fixed to the frontcomponent. By creating a tray with at least two distinct traycomponents, each component may be made from different materials and bydifferent processes than the other component, such that each componentmay be formed to have the most optimal properties for its specificfunctionalities. For example, the front component may be formed to beaesthetically pleasing to a user of the electronic device, for example,by matching the color and/or material of the component with that of thedevice housing. Therefore, the materials, processes, and finishes usedto form the front component may be chosen in accordance with those usedto form the device housing. On the other hand, the materials, processes,and finishes that may be used to form the back component may be chosenwithout respect to the device housing and/or the front component, andinstead the back component may be formed such that the structure of theback component is strong enough and accurately dimensioned to receivethe ejectable module. The back component and the front component may befixed to one another using any suitable process, such as brazing orwelding.

It is understood that the steps shown in process 1400 of FIG. 14 aremerely illustrative and that existing steps may be modified or omitted,additional steps may be added, and the order of certain steps may bealtered.

FIG. 15 is a flowchart of another illustrative process 1500 formanufacturing a tray of an ejectable component assembly. At step 1502 ofprocess 1500, a back component of a tray for retaining at least aportion of an ejectable module may be formed. At step 1504, anon-conductive element may be provided to at least one portion of theback component that is configured to touch an electrical contact of themodule. For example, one or more non-conductive portions may be appliedto the back component using any suitable approach, such as by physicalvapor deposition (“PVD”) using Parylene or any other suitable material,by spraying a non-conductive paint, by dip coating, by pad printing, byapplying non-conductive labels, by adhering other suitablenon-conductive elements, and the like. In some embodiments, suchnon-conductive elements may be applied to the back component of the trayafter the back component has been fixed to a front component. Suchnon-conductive portions may be especially useful when the back componentis conductive and configured to retain a micro-SIM card or any othermodule that may include contacts that extend very close to if not allthe way to one or more edges of the card.

It is understood that the steps shown in process 1500 of FIG. 15 aremerely illustrative and that existing steps may be modified or omitted,additional steps may be added, and the order of certain steps may bealtered.

While there have been described systems and methods for providingcompact ejectable assemblies in electronic devices, it is to beunderstood that many changes may be made therein without departing fromthe spirit and scope of the invention. Insubstantial changes from theclaimed subject matter as viewed by a person with ordinary skill in theart, now known or later devised, are expressly contemplated as beingequivalently within the scope of the claims. Therefore, obvioussubstitutions now or later known to one with ordinary skill in the artare defined to be within the scope of the defined elements. It is alsoto be understood that various directional and orientational terms suchas “up and “down,” “front” and “back,” “top” and “bottom” and “side,”“length” and “width” and “thickness,” and the like are used herein onlyfor convenience, and that no fixed or absolute directional ororientational limitations are intended by the use of these words. Forexample, the devices of this invention can have any desired orientation.If reoriented, different directional or orientational terms may need tobe used in their description, but that will not alter their fundamentalnature as within the scope and spirit of this invention. Moreover, anelectronic device constructed in accordance with the principles of theinvention may be of any suitable three-dimensional shape, including, butnot limited to, a sphere, cone, octahedron, or combination thereof,rather than a hexahedron, as illustrated by FIGS. 1-15.

Therefore, those skilled in the art will appreciate that the inventioncan be practiced by other than the described embodiments, which arepresented for purposes of illustration rather than of limitation.

1. A tray for inserting a removable module into an electronic devicecomprising: a back component configured to retain at least a portion ofthe module; and a front component fixed to the back component andconfigured to mate with an opening in a housing of the electronicdevice.
 2. The tray of claim 1, wherein a portion of the back componentis configured to touch an electrical contact of the module.
 3. The trayof claim 2, wherein the portion of the back component is covered with anon-conductive element.
 4. The tray of claim 1, wherein the backcomponent is configured to retain a micro-subscriber identity modulecard.
 5. The tray of claim 1, wherein the back component is configuredto retain a mini-subscriber identity module card.
 6. A method forforming a tray for an ejectable module assembly of an electronic devicecomprising: forming a back component for retaining at least a portion ofan ejectable module; forming a front component for mating with anopening in a housing of the electronic device; and fixing the backcomponent to the front component.
 7. The method of claim 6, wherein: theforming the front component comprises using a first process and a firstmaterial; the forming the back component comprises using a secondprocess and a second material; and at least one of the first process isdifferent than the second process and the first material is differentthan the second material.
 8. The method of claim 6, wherein the fixingcomprises welding.
 9. The method of claim 6, further comprising applyinga non-conductive element to at least one portion of the back componentthat is configured to touch an electrical contact of the module.
 10. Themethod of claim 6, wherein the forming the back component comprisesforming the back component for retaining a micro-subscriber identitymodule card.
 11. The method of claim 6, wherein the forming the backcomponent comprises forming the back component for retaining amini-subscriber identity module card.
 12. A method for forming a trayfor an ejectable module assembly of an electronic device comprising:forming a back component for retaining at least a portion of anejectable module; and providing a non-conductive element to at least oneportion of the back component that is configured to touch an electricalcontact of the module.
 13. The method of claim 12, wherein the providingcomprises coating the at least one portion with a non-conductivematerial.
 14. The method of claim 12, wherein the providing comprisesphysical vapor depositing a non-conductive material on the at least oneportion.
 15. The method of claim 12, wherein the forming the backcomponent comprises forming the back component out of metal.
 16. Anelectronic device comprising: a housing having an opening; a mountingcomponent within the housing; a cage; a fixing element coupling the cageto the mounting component; and a tray operable to be inserted throughthe opening and into a space between the cage and the mountingcomponent, wherein the fixing element only allows the tray to beinserted into the space when the tray is in a first orientation withrespect to the mounting component.
 17. The electronic device of claim16, further comprising a guide positioned at least partially within thespace, wherein the fixing element is positioned between the guide andthe opening.
 18. The electronic device of claim 16, wherein the mountingcomponent is one of a circuit board and a base module.
 19. An electronicdevice comprising: a housing having an opening; a guide within thehousing; a tray operable to be inserted through the opening and alongthe guide; and a biasing mechanism comprising: a first end fixed to afirst portion of the guide; a second end contacting a second portion ofthe guide; and a middle portion biased against a portion of the tray.20. The electronic device of claim 19, wherein the second end abuts thesecond portion of the guide.
 21. The electronic device of claim 19,wherein the portion of the tray comprises a detent.
 22. The electronicdevice of claim 19, wherein at least one of the middle portion of thebiasing mechanism and the portion of the tray comprises an overmold. 23.An electronic device comprising: a housing having an opening; a circuitboard within the housing; a base coupled to the circuit board; anelectrical pin extending away from the base; and a module operable to beinserted into the device through the opening and to contact theelectrical pin, wherein the electrical pin is operable to deflectthrough a gap in the base in response to the module contacting the pin.24. The electronic device of claim 23, wherein the circuit boardcomprises a recess, and wherein the electrical pin is operable todeflect into the recess in response to the module contacting the pin.25. The electronic device of claim 23, further comprising a guide forguiding the module into the device, wherein the guide and the base are asingle unitary component.